With the accumulated 7 years of success in PCB industry, we are now able to produce rigid PCB up to 24 layers. Here is our capacity :
| Feature | Condition | Current | |
|---|---|---|---|
| Structure | Layer Count | Maximum | 24 |
| Board Thickness | Min / max | 0.36 to 4.01 mm | |
| Sequential Build-Up | 1+N+1/2+N+2 | ||
| 3+N+3(IVH) | |||
| Sequential Lamination | N+N, N+N (Microvia) | ||
| Via in Pad and laser via filling | Filled by Cu Paste / capped | Yes | |
| Material | FR4, RCC, Rogers RO4000, Halogen Free | Yes | |
| Copper Foil | Inner and outer Layers | 1/3oz - 5 oz | |
| Solder Mask | Solder Mask Opening / Dam | Minimum | 0.038mm / 0.76mm |
| Dielectric Thickness | SBU Dielectric | Min / max | 0.038 to 0.127 mm |
| IVH Core Thickness | Min / max | 0.102 to 2.54mm | |
| Core and prepreg Thickness | Minimum | 0.051mm | |
| Hole Formation | Mechanical Hole | Minimum | 0.152mm |
| IVH Hole Size | Maximum | 0.406mm | |
| Laser Hole Drill Size | Min / max | 0.076 to 0.203mm | |
| Pad Size (Mechanical Hole) | Inner Layer | Drill size+0.203mm | |
| Outer Layer | Drill size+0.152mm | ||
| Inner Layer Clearance | Drill size+0.305mm | ||
| Registration Capability | Layer to Layer | 0.076mm | |
| Electrical Capability | Minimum Line and space | ½ Oz / 1 Oz | 0.051mm/0.076mm |
| Impedance Control | +/-10% | ||
| Plating Capability | Aspect Ratio | Mechanical Through Hole | 15 / 1 |
| (Depth: Diameter) | Laser Blind Via | 1 to 1 | |
| Dimension Tolerance | Board Thickness | = 20mil | +/-0.051mm |
| > 20mil | +/-10% | ||
| Fiducial Mark to Fiducial Mark | +/-0.038mm | ||
| Hole to Hole | +/-0.076mm | ||
| Hole to Edge | +/-0.127mm | ||
| Edge to Edge | +/-0.102mm | ||
| Surface Finish | OSP, Electroless Nickel/Immersion Gold (ENIG), Selective OSP/ENIG, Immersion Silver, Hot Air Solder Levelling (HASL) and LF HASL, Immersion Tin, Carbon Ink. | ||
Asia One Technics Ltd.
Office 01, 28/F., Singga Commerical Center,
144-151 Connaught Road West,
Western, HONG KONG
Tel : (852) 3528 0460
Fax : (852) 3528 0470
| Email: |  |
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